UV laser marking machine(MZ-3UV/MZ-5UV/MZ-10UV/MZ-15UV)

The reaction mechanism during laser processing is achieved through photochemical ablation, which relies on laser energy to break the bonds between atoms or molecules, causing them to vaporize or evaporate into small molecules. UV laser marking is characterized by a small focused spot and a wide range of applicable materials, primarily targeting the high-end market for precision processing.

1. Equipment Features

The reaction mechanism during laser processing is achieved through
photochemical ablation, which relies on laser energy to break the bonds between
atoms or molecules, causing them to vaporize or evaporate into small molecules.
UV laser marking is characterized by a small focused spot and a wide range of
applicable materials, primarily targeting the high-end market for precision
processing.

– Excellent beam quality, smaller focused spot, minimal thermal impact, and
delicate marking;

– Most plastic materials can absorb UV laser, compensating for the
insufficient processing capabilities of other lasers;

– High marking speed and efficiency;

2.EquipmentAppearance(Reference)

1) Overall Dimensions: Length 650mm * Width 800mm * Height 1500mm (subject to
actual external dimensions)

2) Chiller Dimensions: Length 580mm * Width 290mm * Height 470mm (subject to
actual external dimensions)

3) Total Weight: 120KG (subject to actual weight)

3. Technical Parameters

Item Name	Technical Parameters
Laser Average Power	3W@30Hz/5W@30Hz/10W@50Hz
Repetition Rate	20KHz-200KHZ
Pulse Width	＜15ns
Laser Wavelength	355nm
Beam Quality M²	＜1.2
Beam Divergence Angle	＜2mrad
Standard Engraving Range	110mm110mm/150mm150mm/174mm*174mm(optional)
Recommended Engraving Speed Speed	≤5000mm/s
Minimum Line Width	0.01mm（(depending on material and lens size)
Repetition Accuracy	±0.05mm
Power Requirements	220V±22V / 50Hz / 10A
Total Power Consumption	≤1000W
Cooling Method	Water Cooling

4. Hardware Configuration

Optical System	UV laser	3W/5W/10W	china	Integrated UV Laser
	UV Galvanometer	10mm	china	Zhibo,Ouye,or Saipusen
	UV Focusing Lens	F254	china	Custom
Contol System	Marking Control Card	EzCAD2	china	BJJCZ
	Marking Software	EzCAD2	china	BJJCZ
	Industrial Computer	PC	china	/
	Display	19-inch LCD	china	Founder or Dell
Cooling System	Constant Temperature Chiller	CWUL	china	Teyu

5. Sample Images


Plastic Logo Marking	Precision Exterior Part Marking	Charger Marking

Plastic Shell Marking	3C Product Marking	Computer Keyboard Marking

Samples Subject to Actual Results

6. Working Environment Requirements

1) Ambient temperature should be between 0-35°C, and air conditioning is
required;

2) Humidity should be between 45%-75%. No condensation is allowed, and a
dehumidifier should be installed;

3) Power supply requirements: 220V, 50Hz;

4) Power grid fluctuation: ±5%, and the grounding wire must comply with
international standards. In areas with voltage amplitude exceeding 5%, an
electronic automatic voltage and current stabilizer should be installed;

5) There should be no strong electromagnetic signal interference near the
installation site. Avoid radio transmission stations (or relay stations) in the
surrounding area;

6) Foundation vibration amplitude: recommended to be less than 50 µm;
vibration acceleration: recommended to be less than 0.05g. Avoid having a large
number of stamping or other machine tool equipment nearby;

7) The equipment space must be smoke-free and dust-free. Avoid environments
with severe dust, such as metal polishing or grinding;

8) Strict requirements for the quality of cooling water: purified water,
deionized water, or distilled water must be used. Tap water, mineral water, or
other liquids containing high levels of metal ions or minerals are not
allowed.

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