Experimental vacuum plasma equipment

Number	Project	Technical Parameter
1	Specifications of the whole machine	650mm(W) ×550mm(D)×450mm(H)
2	Vacuum chamber specifications	Imported aluminum200(W) ×200(H)×250(D)mm,10L
3	Electrode plate specifications	Specialized aluminum electrode150(L) × 150(W)mm
4	vacuum pump system	Mechanical rotary vane vacuum pump (external)
5	Vacuum measurement system	Pirani resistance vacuum gauge
6	Gas metering system	Adjustable float flow meter
7	Number of gas pathways	2 channels intake, 1 way venting
8	Plasma generator	40KHz，High frequency generator, 0-1000W adjustable
9	Working gas	2 working gas options available：Ar2、N2、H2、O2
Features	1. High precision, fast response, good handling and compatibility, complete functions and professional technical support； 2. It is suitable for surface cleaning and activation of small products in university laboratories and semiconductor IC fields.
Industry	It is suitable for cameras and industries, mobile phone manufacturing, semiconductor IC fields, silica gel, plastics, polymer fields, automotive electronics industry, aviation industry, etc.
Application	1. Camera and fingerprint recognition industry: Oxidation removal on the surface of the gold PAD of the soft hard bonding board; IR surface cleaning and cleansing; 2. In the field of semiconductor ICs, COB, COG, COF, ACF processes are used for cleaning before wire bonding and soldering; 3. Silicone, plastic, and polymer fields: Surface roughening, etching, and activation of silicone, plastic, and polymer.

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