HDI PCB with Microvias for High-Density Compact Electronics

HDI PCB with Microvias – Compact and High-Density Solutions

Introduction

Our HDI PCBs with microvias are designed to achieve ultra-high circuit density for compact electronic devices. Microvias enable precise multi-layer connections with minimal board area, supporting miniaturized and lightweight electronics. These PCBs offer excellent electrical performance, high signal integrity, and reliable operation in demanding applications.

Key Features

• Ultra-high-density circuit design for miniaturized devices

• Microvia technology for precise layer-to-layer connections

• Excellent signal integrity and low EMI

• Reliable and stable electrical performance

• Supports compact, lightweight, and portable electronics

• Customizable copper thickness, board size, and surface finish

Specifications

• Base Material: FR-4, High TG options

• Board Thickness: 0.4–1.6 mm

• Copper Thickness: 1/2 oz, 1 oz, 2 oz

• Min. Line/Spacing: 0.08 mm / 0.08 mm

• Min. Hole Size: 0.1 mm

• Via Type: Microvias

• Surface Finish: ENIG, OSP, Lead-free HASL

• Flexibility: Rigid or flexible PCB

• Applications: High-density electronics, compact devices

Packing & Delivery

• Each PCB packed in anti-static bag

• Protected with bubble wrap or foam

• Carton box with fragile label

• Quantity per carton as requested

• Label shows part number and lot

• Ship by air, sea, or courier

• Store dry, avoid sunlight and humidity

Why Choose Our HDI PCB

• Advanced microvia technology for ultra-compact boards

• High precision and reliable signal performance

• Suitable for miniaturized and portable electronics

• Supports prototype to mass production volumes

• Professional support for global electronic clients